KOCH CHEMIE MICRO CUT PAD 

The Koch Chemie Micro Cut Pad delivers faultless results:

Product Features

• High-quality, unique sponge designed to remove fine scratches, holograms, and polishing marks.

• Compatible with the Micro Cut M3.02 and Micro Cut & Finish P3.01.

• The short height of 23mm reduces torsion forces, resulting in great handling and stability.

• Special density of foam material allows for long-lasting compression hardness during polishing.

• The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and great cleanliness.

• Milling edge allows pads to easily fit around curves.

• Colourful non-woven material perfect for polishing guarantees process safety.

• Compression hardness: 10; Abrasiveness: 5.