

Description
KOCH CHEMIE MICRO CUT PAD
The Koch Chemie Micro Cut Pad delivers faultless results:
Product Features
- High-quality, unique sponge designed to remove fine scratches, holograms, and polishing marks.
- Compatible with the Micro Cut M3.02 and Micro Cut & Finish P3.01.
- The short height of 23mm reduces torsion forces, resulting in great handling and stability.
- Special density of foam material allows for long-lasting compression hardness during polishing.
- The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and great cleanliness.
- Milling edge allows pads to easily fit around curves.
- Colourful non-woven material perfect for polishing guarantees process safety.
- Compression hardness: 10; Abrasiveness: 5.