MICRO CUT PAD

The Koch-Chemie Micro Cut Pad is painstakingly developed for optimal performance and provides professional-grade polishing.

Key features

• High-quality sponge for removing fine scratches, holograms, and polishing marks

• Compatible with the Micro Cut M3.02 and Micro Cut & Finish P3.01.

• The short height of 23mm reduces torsion forces, resulting in great handling and stability.

• Special foam material density provides long-lasting compression hardness for polishing.

• Improved reticulation (open cellular structure) and cell count for a high-shine finish and enhanced cleanliness.

• Milling edge improves flexibility, allowing easy contour fitting.

• Colourful nonwoven materials ensure process safety.

Specifications

• Compression hardness: 10.

• Abrasiveness: 5.

Notice

This product information is provided as guidance only and is not binding. Please confirm the product's appropriateness for your specific use. We are available to answer any questions you may have.