
Description
Q2M Compound+ REDEFINED
Heavy cutting compound - improved
Achieve superior scratch removal and a high-gloss finish with the Q²M Compound+ REDEFINED 120ml. This heavy cutting paste delivers exceptional abrasion with minimal dust and secondary defects. While it leaves light holograms, they are easily removed with a single pass of Q²M Polish. The redefined formula enhances cutting power without sacrificing a smooth, glossy finish.
Why Choose Q²M Compound+ REDEFINED?
- High Cutting Power: Delivers increased cutting power for effective scratch and defect removal.
- Glossy Finish: Leaves a high-gloss finish, minimizing the need for extensive follow-up polishing.
- Minimal Dust & Defects: Water-based formula with high-quality Japanese abrasives reduces dust and secondary defects.
- Easy Pre-Coating Preparation: Contains no silicone or fillers, simplifying pre-coating preparation and polish removal.
- Improved Formula: Part of GYEON's REDEFINED line, offering enhanced performance, durability, and ease of use.
- Longer Working Cycle: Retains high cutting power and maintains a longer working cycle without drying out, ideal for high-temperature and humid climates.
Key Features
- Heavy cutting compound.
- Improved scratch removal.
- High abrasion with minimal dust.
- Water-based formula with Japanese abrasives.
- No silicone or fillers.
- Longer working cycle.
- 120ml capacity.
Pro Tip
- Use with a rotary or dual-action polisher for optimal results.
- Work in small sections, moving the machine slowly across the surface.
- Reduce speed and temperature for best results due to its water-based formula.
- Follow up with Q²M Polish for a perfect, hologram-free finish.